20-Position Mezzanine Header at 0.50 mm Pitch
The Hirose DF12(5.0)-20DP-0.5V(86) is a 20-position board-to-board header from the DF12 series, designed for parallel PCB stacking. Gold plating on the contacts (8.00 µin thickness) provides corrosion resistance suitable for moderate mating-cycle duty in controlled environments.
What the 5 mm Stacking Height Means for Your Assembly
The 5 mm mated stacking height is the dimension from the top of the bottom PCB to the bottom of the top PCB when the header and its mating receptacle are fully engaged. This sets the z-axis clearance for any components mounted on the underside of the top board. At 0.50 mm pitch, the routing channels between pads are tight — a 4-layer board with 0.2 mm traces and 0.2 mm spacing is feasible, but the outer rows of the header leave limited room for via-in-pad without shorting to adjacent signals.