The Hirose DF17A(2.0)-80DP-0.5V(57) is an 80-position mezzanine header from the DF17 series, designed for parallel board-to-board stacking in compact electronics. A built-in board guide on the housing helps keep the part square during reflow placement, which matters on an 80-position part where even a few degrees of skew can short adjacent rows.
Mated Stacking Heights and Board Spacing
This header is rated for two mated stacking heights: 5mm and 6mm. That means the same board-mounted header can pair with either a 5mm or 6mm receptacle height variant from the DF17 series, giving the layout engineer a 1mm adjustment in z-height without changing the header footprint. The 4.30mm height above board is the header alone — the total stack is the sum of the header height plus the receptacle height, so the 5mm and 6mm figures are the finished board-to-board gap when mated.
Eighty positions on a 0.50mm pitch gives a dense interconnect for a high-signal-count mezzanine link. The 0.50mm pitch means the PCB traces between pads need controlled impedance routing if the signal edge rates are fast — the narrow pitch limits the trace width you can run between pads. The dual-row layout keeps the connector body width manageable; the 80 positions are split 40 per row.
The RoHS compliance is documented, so no exemption paperwork is needed for EU-market builds.