0.50 mm Pitch, 80-Position Mezzanine Receptacle
The Hirose DF17B(4.0)-80DS-0.5V(57) is an 80-position receptacle from the DF17 series, designed for board-to-board mezzanine stacking. It accepts mated stacking heights of 6mm, 6.5mm, and 8mm, giving the board layout engineer a range of z-height options for parallel PCB spacing.
The three supported mated stacking heights — 6mm, 6.5mm, and 8mm — let you dial in the gap between boards without changing the receptacle footprint. The 0.177" (4.50mm) height above board is fixed for this part; the variation comes from the mating header's post height. For a 6mm stack, the header sits 1.5mm above the opposite board; for 8mm, it's 3.5mm. That range covers most mezzanine layouts from compact handhelds to modules needing airflow clearance.
Solder Retention and SMT Reliability
The solder retention tabs are a practical detail on this 80-position part. The connector stays put through reflow and doesn't lift when the mating header is inserted or removed. For a board assembly line, that means fewer tombstoned connectors and less rework.
Position Count Comparison: 80 vs 30 Positions
The 80-position DF17B(4.0)-80DS-0.5V(57) shares the same 0.50mm pitch, dual-row layout, and 4.50mm height above board as the 30-position DF17B(4.0)-30DS-0.5V(57). The difference is purely the position count — 80 circuits vs 30 circuits — which changes the board footprint length.
Board Guide Variant: DF17(4.0)-80DS-0.5V(57)
The sibling DF17(4.0)-80DS-0.5V(57) is identical in pitch, position count, height, and plating, but adds a board guide feature. The board guide consists of alignment posts that help register the connector during placement — useful if your pick-and-place machine needs mechanical alignment before the solder paste holds the part. The DF17B(4.0)-80DS-0.5V(57) omits those posts, which saves a little board real estate around the footprint. Choose the board guide version if your assembly process benefits from the extra alignment; otherwise, the B version fits the same layout.