Mezzanine Header for Tight Board Spacing
The Hirose DF17(1.0H)-30DP-0.5V(57) is a 30-position header from the DF17 series of board-to-board mezzanine connectors. It uses a 0.020" (0.50mm) pitch in a dual-row layout, with gold-plated outer shroud contacts that mate with the corresponding DF17 receptacle. The mated stack height is 4mm, which sets the spacing between the two parallel PCBs. This is a surface-mount part with board guide features and solder retention aids to keep it aligned during reflow.
The 4mm mated stack height is the defining dimension for this connector — it determines the z-height clearance between the two boards in a mezzanine stack. The header itself stands 0.130" (3.30mm) above the board surface before mating.
Position Count and Routing
30 positions at 0.50mm pitch gives 60 total I/O across two rows. That position count matches many parallel data buses and GPIO banks on embedded processors and FPGAs. The 0.50mm pitch requires controlled impedance routing on the PCB — standard 0.5mm-pitch design rules with 0.25mm trace/space are adequate for most signal speeds up to a few hundred MHz.
SMT Assembly and Retention
Surface mount termination means this header goes through a reflow oven alongside other SMD components — no separate wave solder step. Gold plating on the contacts handles the mating cycles typical of production test and field service without corrosion issues.
Position Count Variants in the DF17 Series
The DF17 series includes the same 30-position count in a taller stack height variant — the DF17(2.0)-30DP-0.5V(57) with a 0.169" (4.30mm) height above board, which gives a larger post-mate gap. For higher I/O density, the DF17(1.0H)-60DP-0.5V(57) doubles the position count to 60 at the same 0.50mm pitch and 0.130" (3.30mm) height. The DF17(2.5)-26DP-0.5V(57) offers 26 positions at a 0.189" (4.80mm) height. The position count and stack height are the two variables to match against your board layout and z-height budget.