Mezzanine Header for Tight Board Spacing
The Hirose DF17(2.0)-30DP-0.5V(57) is a 30-position, 0.50mm pitch mezzanine header from the DF17 series, designed for parallel board-to-board stacking. It uses outer shroud contacts — a configuration that protects the mating interface during alignment and supports the 5mm and 6mm mated stacking heights this part is rated for.
At 0.50mm pitch, the pad-to-pad clearance on the PCB is tight enough that solder mask registration matters — a misaligned stencil can bridge adjacent joints. The solder retention feature built into this header helps anchor the SMT pads during reflow, reducing the risk of tombstoning or skew from paste wetting forces.