Board-to-Board Mezzanine Fit
The Hirose DF17(3.0H)-60DS-0.5V(57) is a 60-position receptacle with center strip contacts, part of the DF17 series designed for parallel board stacking. The 0.020" (0.50mm) pitch and 0.118" (3.00mm) height above board set the z-height budget for the mezzanine gap. Gold contact finish on both rows supports repeated mating cycles during production test or field replacement — the plating resists corrosion and maintains contact resistance over the connector's service life.
Stack Height and the 3.0H vs 3.0 Variant
The "3.0H" in the order code refers to the 0.118" (3.00mm) height above board, which gives a 4mm mated stack height with its header counterpart. The sibling DF17(3.0)-60DS-0.5V(57) uses a 0.138" (3.50mm) board height, pushing the mated stack to 4.5mm. Both carry the same 60 positions and 0.50mm pitch — the choice is purely about the z-height clearance in your assembly. If your board-to-board gap is 4mm, the 3.0H variant is the one; if you have an extra 0.5mm to spare, the standard 3.0 fits.
No direct second-source is listed; the DF17 series is Hirose-proprietary, so stick with the mating header from the same series for guaranteed fit and stack height.