Board-stacking header for tight-pitch mezzanine designs
The Hirose DF17(4.0)-60DP-0.5V(57) is a 60-position surface-mount header from the DF17 series, designed for parallel board-to-board stacking. Gold plating on every contact gives it corrosion resistance for repeated mating cycles, and the 6.30 mm height above board lets it pair with receptacles at 7 mm or 8 mm mated stacking heights.
At this pitch, the outer shroud contacts are a practical feature: they keep the signal pins from snagging during assembly and protect them from ESD events before the boards are stacked. The 60 positions in two rows give you 30 contacts per row, which matches a 60-circuit BOM line. The mated stacking heights of 7 mm and 8 mm mean this header works with the matching DF17 receptacle to create a fixed-z-height interconnect — the 6.30 mm header height plus the receptacle's own height lands at one of those two stack heights, so confirm your board-to-board gap before specifying.
This header is surface-mount only — no through-hole legs. That matters on a 60-position, 0.50 mm pitch part where a 0.1 mm misalignment during reflow opens shorts or opens.
Position count comparison: 60 vs 50 and 70
The DF17 series offers this header in 50, 60, 70, and 80 positions at the same 0.020" (0.50mm) pitch and same 6.30 mm height. The DF17(4.0)-60DP-0.5V(57) sits at 60 positions — the DF17(4.0)-50DP-0.5V(57) gives you 50 positions, the DF17(4.0)-70DP-0.5V(57) gives 70 positions. The 60-position version is the middle option in the range.