0.50mm Pitch, 70-Position Mezzanine Header
The Hirose DF17(4.0)-70DP-0.5V(57) is a 70-position, 2-row surface-mount header from the DF17 series, designed for parallel board-to-board stacking. The 0.020" (0.50mm) pitch packs 70 gold-plated contacts into a compact footprint, suited for dense signal routing in mezzanine card assemblies.
Stack Height and Board Spacing
This header supports mated stacking heights of 7mm and 8mm, with a height above board of 0.248" (6.30mm). That range covers common mezzanine card gaps — 7mm for tighter enclosures, 8mm for more component clearance on the underside of the top board. The 0.50mm pitch keeps the footprint narrow, so routing escape traces between pads is tight but manageable with standard PCB fabrication tolerances.
Position Count and Series Fit
At 70 positions, this header sits between the 60-position DF17(4.0)-60DP-0.5V(57) and the 80-position DF17(4.0)-80DP-0.5V(57) in the same DF17 series. Pick the position count that matches your signal channel requirement; the footprint grows linearly with the row length.
Compliance and Lifecycle
The product status is Active and it is ROHS3 Compliant.
The Tape & Reel packaging suits automated assembly lines; the Cut Tape option works for prototype or low-volume builds.