80-Position Mezzanine Header for Tight Board Stacks
The Hirose DF17(4.0)-80DP-0.5V(57) is an 80-position header with outer shroud contacts from the DF17 series, designed for parallel board-to-board stacking. Its 0.020" (0.50mm) pitch packs 80 circuits into a dual-row layout, making it the highest-position-count member of the DF17 family at this pitch. The connector stands 0.248" (6.30mm) above the board and supports mated stacking heights of 7mm or 8mm, giving the layout engineer two board-gap options from a single header footprint.
Position Count vs Siblings in the DF17 Series
The DF17(4.0)-80DP-0.5V(57) shares the same 0.020" (0.50mm) pitch, 0.248" (6.30mm) board height, dual-row layout, gold contact finish, and surface-mount termination as the 70-position DF17(4.0)-70DP-0.5V(57) and the 60-position DF17(4.0)-60DP-0.5V(57). All three are active and use the same footprint class, so swapping between them requires a board layout change only at the connector pad array length.
The 80-position variant is the densest option in the series, and the active status means no last-time-buy risk for ongoing production.
