0.40 mm Pitch Header for Tight Mezzanine Stacking
The Hirose DF30FC-20DP-0.4V(82) is a 20-position header from the DF30 series, built for board-to-board mezzanine connections where vertical space is at a premium. It uses a 0.016" (0.40mm) pitch across two rows, which keeps the board footprint small but demands a matching PCB layout — standard 0.5 mm or 0.8 mm pitch designs won't fit.
Mated Stacking Height and Board Fit
The header itself sits 0.031" (0.80mm) above the board surface. That 0.9mm envelope is tight: it suits ultra-slim products like smartphones, wearables, or compact modules, but it won't clear taller components on the opposing board. Confirm your enclosure's z-height budget against this dimension before committing.
20 Positions vs the 24-Position Sibling
The DF30FC-20DP-0.4V(82) carries 20 positions. The DF30FC-24DP-0.4V(81) is the 24-position version at the same 0.016" (0.40mm) pitch and 0.031" (0.80mm) height above board. No other functional difference (same gold plating, same SMT mounting, same active lifecycle) separates them.