Ultra-Compact Board-to-Board Stacking at 0.9mm
The Hirose DF30FC-24DS-0.4V(81) is a 24-position receptacle from the DF30 series, designed for tight board-to-board stacking applications where vertical clearance is at a premium. With a 0.016" (0.40mm) pitch and dual-row layout, it packs 24 circuits into a footprint that suits high-density routing in compact handheld devices, camera modules, or display interfaces. The mated stack height is 0.9mm, with the connector sitting 0.035" (0.88mm) above the board — a combination that fits the tight z-height budgets of ultra-slim electronics. Gold contact finish with 2.00µin (0.051µm) thickness provides corrosion resistance for the limited mating cycles typical of internal FPC-to-board connections.