0.40mm Pitch, 30-Position Mezzanine Receptacle
The Hirose DF30FC-30DS-0.4V(81) is a 30-position receptacle with outer shroud contacts from the DF30 series, designed for board-to-board mezzanine stacking at a tight 0.016" (0.40mm) pitch.
The 0.9mm mated stacking height is the defining mechanical constraint for this connector. It dictates the exact board-to-board spacing, so the mating header must be selected from the DF30 series to maintain that gap. The 0.40mm pitch means the PCB footprint requires tight routing — trace widths and clearances need to match the fine-pitch pattern. The 0.035" (0.88mm) height above board gives the receptacle a low profile on the top side, critical when the enclosure lid clears the component by less than a millimeter.
Contact Finish and Duty Cycle
Gold contact finish at 2.00µin (0.051µm) thickness is a flash plating. It protects the mating surface from oxidation during the first few mates, but the thin layer wears faster than a thicker gold or duplex finish. For frequent reconnection or field-service cycles, a heavier gold plate would be the better call.
Listed with an active lifecycle status. The Tape & Reel packaging (with Cut Tape option) suits both prototype builds and production reel-feeder placement.