Board-Stack Interconnect at 0.40mm Pitch
The Hirose DF30FC-30DS-0.4V(82) is a 30-position receptacle from the DF30 series, designed for mezzanine board-to-board stacking where board real estate is tight. The 0.016" (0.40mm) pitch and dual-row layout pack 30 circuits into a compact footprint — the 0.035" (0.88mm) height above board and 0.9mm mated stacking height set the z-axis budget for the board pair. Gold-plated contacts with 2.00µin (0.051µm) thickness handle the mating cycles typical of a board-stack assembly, where the connector mates once during production and stays mated through the product life.
30 vs 34 Positions — Same Footprint Class
The DF30FC-30DS-0.4V(82) shares the same 0.40mm pitch, 0.88mm height, and gold plating as the DF30FC-34DS-0.4V(82). Both use the same board footprint pattern and mate with the same DF30 series header — the choice comes down to how many signal lines the BOM requires.