Board-Stacking Fit for Tight Z-Budgets
The DF30FC-34DS-0.4V(82): It uses a 0.016" (0.40mm) pitch across two rows, with outer shroud contacts that guide the mating header into alignment. The mated stacking height is 0.9mm, and the connector sits 0.035" (0.88mm) above the board surface — numbers that matter when you're squeezing a mezzanine layer into a phone or wearable. The contact finish is gold with a thickness of 2.00µin (0.051µm). The gold keeps oxidation off the mating interface, which is the main concern at this pitch where contact force is low.
Position Count vs the 30-Position Sibling
The DF30 series offers this 34-position variant alongside a 30-position version (DF30FC-30DS-0.4V(82)) at the same 0.016" (0.40mm) pitch and 0.9mm mated height. The decision between them is purely a circuit-count match — the footprint, stack height, and contact plating are identical. If your BOM calls for 34 signal lines, this is the one; if you're at 30, the sibling saves a few mm² of board real estate.