70-Position Mezzanine Header at 0.40 mm Pitch
The DF30FC-70DP-0.4V(81): It uses a center strip contact arrangement in a dual-row layout at 0.016" (0.40mm) pitch, and the mated stack height comes to 0.9mm — one of the lowest profiles in the series. The gold-plated contacts (2.00µin thickness) suit repeated mating cycles common in portable or modular electronics. Surface-mount termination keeps the assembly compatible with standard reflow processes.
With a height above board of 0.031" (0.80mm) and a mated stacking height of 0.9mm, this header is built for thin-profile assemblies — think compact handheld devices, camera modules, or display interconnects where every tenth of a millimeter counts. The 0.40mm pitch forces tight routing on the PCB; trace widths and spacing need to match the fine-pitch land pattern. The dual-row arrangement packs 70 interconnects into a footprint that a coarser-pitch connector would need twice the board area to match.
The contact finish is gold on both the header and receptacle side, so the mating interface is corrosion-resistant and rated for repeated connect-disconnect cycles. Termination is surface-mount only; no through-hole version exists in this series.
Position Variants in the DF30 Series
The DF30 series offers the same 0.40mm pitch and 0.9mm stacking height in 80-position variants — DF30FC-80DP-0.4V(81) and DF30FC-80DP-0.4V(82). The footprint, pitch, and stack height are identical, so the board layout for the 80-position part is simply longer. If your BOM calls for 80 I/O, the 70-position part won't fit — match the circuit count exactly.