The Hirose DF30FC-70DP-0.4V(82) is a 70-position, 2-row header with center strip contacts from the DF30 series, designed for parallel board-to-board stacking in compact electronics. Its 0.40 mm pitch and 0.80 mm height above board make it a fit for dense mezzanine applications where z-height is tight — think smartphone mainboards, wearable PCBs, or camera modules where every tenth of a millimeter counts. The gold-plated contacts carry signal-level current; the 2.00 µin gold flash is standard for internal connections with moderate mating cycles.
This header mates to a matching DF30 receptacle to achieve a 0.9 mm mated stacking height between parallel PCBs. The 0.40 mm pitch forces tight routing; a 70-position, 2-row layout means 35 contacts per row, so the board footprint is roughly 14 mm long by 3 mm wide, depending on the keep-out from the alignment features.
Plating and Duty Cycle
This is not a connector for repeated field-service reconnects or corrosive atmospheres; it's suited for one-time assembly or occasional rework inside a sealed device.
Comparing the 70-Position Variant
Against the DF30FC-80DP-0.4V(82), the 70-position version drops 10 circuits — 35 per row instead of 40 per row — at the same 0.40 mm pitch and 0.80 mm height. The footprint length shrinks by about 4 mm, which can free board space for other components or trace routing.