70-Position, 0.40 mm Pitch Mezzanine Receptacle
The Hirose DF30FC-70DS-0.4V(82) is a 70-position receptacle with outer shroud contacts from the DF30 series, designed for board-to-board mezzanine stacking in space-constrained portable electronics. Its 0.016" (0.40mm) pitch and dual-row layout pack 70 circuits into a compact footprint, while the 0.035" (0.88mm) height above board and 0.9mm mated stacking height suit thin-profile assemblies like smartphones, wearables, and module-on-board interconnects. Gold-plated contacts with 2.00µin (0.051µm) thickness provide corrosion resistance for the expected mating cycle count in a sealed consumer device.
Pitch and Stack Height Drive the Fit
The 0.016" (0.40mm) pitch is the tightest in the DF30 family — it forces fine-line PCB routing and limits per-contact current to signal-level duty (no power delivery through this connector). The 0.035" (0.88mm) above-board profile means the receptacle sits flush with low-profile components, but the solder joints are small — reflow profile and stencil aperture need tuning for the 0.40mm pitch.
Position Count — 70 vs 80 Circuits
The DF30FC-70DS-0.4V(82) carries 70 positions, while the DF30FC-80DS-0.4V(82) carries 80 positions at the same 0.40mm pitch, same 0.88mm height, and same gold plating thickness. The 10-position delta is the only functional difference — the footprint length scales linearly with position count, so the board layout must match the BOM line count exactly. No other spec (pitch, stack height, plating, or lifecycle status) changes between the two.