Hirose DF30FC-80DP-0.4V(81) — 80-Position, 0.40mm Pitch Mezzanine Header
The Hirose DF30FC-80DP-0.4V(81) is an 80-position header with center strip contacts from the DF30 series, designed for board-to-board mezzanine stacking. At a 0.016" (0.40mm) pitch across two rows, it packs 80 circuits into a narrow footprint — the kind of density you see in compact handheld devices, camera modules, or display interconnects where PCB real estate is the constraint, not the current. The mated stacking height of 0.9mm sets the z-axis gap between boards, so the mating receptacle height and the opposite board's component keep-out zone need to match that dimension. Gold-plated contacts with 2.00µin (0.051µm) thickness handle the few mating cycles typical of a factory-assembled mezzanine stack — this isn't a connector you'd plan to disconnect repeatedly in the field.
80 vs 70 Positions — Which Fits the BOM?
The DF30FC-80DP-0.4V(81) carries 80 positions, while the DF30FC-70DP-0.4V(81) in the same series carries 70 — both at the same 0.40mm pitch and 0.9mm stacking height. The decision is purely a circuit-count match: if your BOM calls for 80 signal lines, the 80-position version is the one; if you only need 70, the 70-position part saves board space and cost. The footprint, contact plating, and overall connector type are identical, so swapping between them is a straight layout change — no need to re-qualify the mating receptacle or the stack height.
Surface Mount Assembly — What to Watch
The 0.40mm pitch means the solder pads are tight — standard SMT reflow profiles for fine-pitch connectors apply, and the stencil aperture needs to match the pad geometry to avoid bridging between adjacent contacts. The center strip contact design provides a continuous ground plane reference under the signal pins, which helps control impedance in the mezzanine stack. No through-hole anchors or board locks are present, so the connector relies entirely on the solder joints for mechanical retention — the mating receptacle's alignment features take the shear load during board assembly.