The Hirose DF30FC-80DP-0.4V(82) is an 80-position, dual-row header from the DF30 series, using a center strip contact arrangement. At a 0.016" (0.40mm) pitch and a mated stacking height of 0.9mm, this is a high-density, low-profile board-to-board interconnect. The 80 circuits at this pitch mean the board designer needs fine-line routing capability — the contact spacing leaves little room for escape routing between pads on standard PCB fab processes. Gold contacts with 2.00µin (0.051µm) thickness handle the mating cycles expected in portable electronics where the connector may see repeated disconnect during assembly or field service.
The mated stacking height of 0.9mm is fixed — there is no adjustment range, so the opposing board's mating receptacle must match exactly. The 0.40mm pitch and 80 positions in two rows produce a connector body roughly 20mm long; the keep-out zone on the board should account for the center strip contacts which extend inward from the board edge. Alignment features on the mating halves take the shear load during assembly, protecting the fine-pitch solder joints.