Board-Stacking Interconnect for Dense Mezzanine Designs
The Hirose DF30FC-80DS-0.4V(81) is an 80-position receptacle from the DF30 series, built for high-density board-to-board stacking. At a 0.016" (0.40mm) pitch across two rows, it packs 80 circuits into a compact footprint — the kind of density you need when routing a dozen parallel buses through a phone or a handheld instrument.
Pitch and Footprint — What 0.40mm Means for Your Board
It forces narrow traces and tight clearances — your PCB fab needs to handle 0.20mm lines and spaces to route out all 80 pads. The dual-row layout means the connector body is about 8mm long, so it fits in a board-edge or mid-board position without crowding adjacent components. Surface-mount termination saves the through-hole vias for other layers.
Stack Height and Z-Axis Fit
Height above board is 0.035" (0.88mm), and the mated stacking height is 0.9mm. That 0.02mm difference is the gap the mating header occupies — so when you design the mezzanine standoff, plan for 0.9mm total clearance between the two PCBs. If your enclosure has a 1.0mm gap, this connector fits; if you need 1.2mm, look at a taller DF30 variant.
Comparing the 80-Position to the 70-Position Sibling
The 80-position gives you ten extra signal lines in the same connector footprint length; the 70-position leaves room for a wider keep-out zone on the board edge. Choose the count that matches your bus width.