The Hirose DF30RC-24DP-0.4V(81) is a 24-position header from the DF30 series, designed as a board-to-board mezzanine interconnect with a center strip contact arrangement. Its 0.016" (0.40mm) pitch and 0.031" (0.80mm) height above board define a very low-profile stacking solution — the mated stack height is 0.9mm, which means the two PCBs sit nearly flush. This is the connector you reach for when the enclosure gap between boards is under 1 mm and every tenth of a millimeter of z-height is already allocated to the display or battery.
At 0.40 mm pitch, the escape routing per layer is tight — you'll need micro-vias or very narrow traces (≤0.20 mm) between the pads. The 2-row arrangement puts 12 contacts per row, so the footprint is a narrow, dense rectangle. The 0.80 mm height above board means the connector body sits low enough that components on the bottom side of the top board must be kept clear of the mating area.
Sourcing and lifecycle — no last-time-buy pressure here
There is no announced end-of-life or last-time-buy window.
This header mates with the corresponding DF30 series receptacle (center strip contacts, same 0.40 mm pitch and 0.80 mm stack height). Termination is surface mount — the SMT pads are on the bottom of the connector body, so the reflow profile must match the gold-plated contact finish.