0.40mm Pitch Header for Tight Board-Stacking
The Hirose DF30RC-30DP-0.4V(81) is a 30-position, 2-row header from the DF30 series, designed for board-to-board mezzanine connections where board real estate is at a premium. The 0.016" (0.40mm) pitch allows dense signal routing, while the 0.031" (0.80mm) height above board keeps the mated stack-up low — suited for compact handheld devices, wearables, and sensor modules where the z-height budget is tight. Gold-plated center strip contacts (2.00µin thickness) provide reliable signal-level connections for repeated mating cycles typical of battery or module interfaces.
Position Count: 30 vs 24, 34, and 40
This 30-position member sits between the 24-position DF30RC-24DP-0.4V(81) and the 34-position DF30RC-34DP-0.4V(81) in the same DF30 series, all sharing the same 0.40mm pitch, 0.80mm mated height, and gold plating. If your design needs 34 circuits, the DF30RC-34DP-0.4V(81) is the drop-in alternative with the same stack height and contact finish; no other board layout changes required beyond the longer footprint.