0.40 mm Pitch, 40-Position SMT Header for Tight Stacking
The Hirose DF30RC-40DP-0.4V(82) is a 40-position, 2-row header from the DF30 series, built for board-to-board or FPC-to-board interconnects where vertical space is at a premium. The 0.016" (0.40mm) pitch packs the 40 circuits into a compact footprint, and the 0.031" (0.80mm) height above board keeps the mated stack low — the listed mated stacking height is 0.9mm. Gold-plated contacts with 2.00µin (0.051µm) thickness handle repeated mating cycles in consumer and portable device assemblies.
Position Counts Across the DF30 Series
The DF30 series shares the same 0.40 mm pitch, 2-row layout, gold plating, and 0.80 mm height across position variants. The DF30RC-40DP-0.4V(82) sits at 40 positions — a middle count between the 34-position DF30RC-34DP-0.4V(81) and the 50-position DF30RC-50DP-0.4V(81). The choice comes down to the number of signal lines your BOM needs; the footprint and routing density are identical across the range.