DF37B-10DP-0.4V(75) — 10-Position Mezzanine Header
The Hirose DF37B-10DP-0.4V(75) is a 10-position header from the DF37 series, designed for board-to-board mezzanine stacking. It uses an outer shroud contact arrangement, meaning the signal pins are recessed within a perimeter shell that guides mating and protects contacts during engagement.
This header sits 0.75mm above the board surface and mates to a complementary receptacle to achieve a mated stack height of 0.98mm. That 0.98mm z-height is the total clearance between the two PCBs after mating — critical for thin-profile enclosures. The 0.40mm pitch forces tight routing between pads; a 4-layer board with microvias is typical for this density.
Gold contact finish at 4.00µin thickness is a standard signal-grade plating. It handles moderate mating cycles without exposing the nickel underplate.