The Hirose DF37B-20DP-0.4V(53) is a 20-position header from the DF37 series, using outer shroud contacts on a 0.40mm pitch in a dual-row layout. It's designed for board-to-board mezzanine stacking where the mated height is 0.98mm — tight for compact handheld or module-to-motherboard interconnects. Gold flash plating (2.00µin) on the contacts handles moderate mating cycles typical of internal device connections.
The 0.40mm pitch drives the board footprint — trace escape between pads needs a fine-line PCB fab capable of 0.20mm or tighter trace/space. The 0.75mm height above board is the header's own standoff from its mounting surface.
Plating Grade and Duty Cycle
If your application needs higher cycle life or sees corrosive atmospheres, the sibling DF37B-20DP-0.4V(75) carries 4.00µin gold, which doubles the wear layer at the same pitch, position count, and stack height. That extra thickness buys you more reconnect margin without changing the footprint.
