0.40mm Pitch, 60-Position Header for Dense Board Stacking
The Hirose DF37B-60DP-0.4V(53) is a 60-position header from the DF37 series, designed for ultra-fine-pitch board-to-board interconnects. With a 0.016" (0.40mm) pitch and dual-row configuration, it packs 60 circuits into a compact footprint suited for space-constrained electronics like smartphones, tablets, and portable devices. The connector type is a header with outer shroud contacts, meaning the mating receptacle nests inside the shroud for self-alignment during board stacking. Gold contact finish on both mating surfaces ensures reliable signal integrity across repeated mating cycles in production and field service.
Stack Height and Board Clearance
The header sits 0.030" (0.75mm) above the board surface, and the specified mated stacking height is 0.98mm.
Position Count Variants in the DF37 Series
The DF37B-60DP-0.4V(53) is the 60-position member of the DF37 series. For lower circuit counts, the DF37B-40DP-0.4V(51) and DF37B-40DP-0.4V(53) offer 40 positions at the same 0.40mm pitch and 0.75mm board height. The position count is the only functional difference — pitch, stack height, contact finish, and mounting are identical across the 40- and 60-position variants. Choose the position count to match the signal channel count on the BOM.