0.40mm-Pitch Mezzanine Header for Tight Board Stacks
The Hirose DF37C-10DP-0.4V(53) is a 10-position, dual-row header in the DF37 series, designed for board-to-board stacking where vertical space is at a premium. Its 0.016" (0.40mm) pitch drives a compact footprint that routes dense signal traces under the connector — expect a tight escape pattern on inner layers. The outer shroud contacts self-align during mate, reducing skew on the fine-pitch pads. Mated stacking height is 0.98mm, which sets the board-to-board gap at just under 1 mm — this part is for ultra-thin mezzanine applications like smartphone mainboards, wearable PCBs, or compact camera modules.
Position Count and the DF37B Sibling
At 10 positions this header fits a 10-circuit BOM line. The DF37C-24DP-0.4V(53) is the 24-position version at the same 0.40mm pitch and 0.75mm board height — choose the position count to match your signal channel count, not the other way around. The DF37B-10DP-0.4V(53) is a near-identical sibling: same pitch, same 10 positions, same 0.75mm board height, but adds solder retention features. If your board has a reflow profile that needs extra pad hold-down, the DF37B variant is the one to specify.