Board-Stacking Fit: 0.40 mm Pitch, 30 Positions, 0.98 mm Mated Height
The Hirose DF37C-30DP-0.4V(53) is a 30-position, dual-row header from the DF37 series, designed for board-to-board mezzanine stacking. The 0.016" (0.40 mm) pitch packs 30 circuits into a compact footprint — the tight pitch means the PCB routing channels between pads are narrow, so the board layout needs a fine-line process. The header sits 0.030" (0.75 mm) above the board and mates to a stacking height of 0.98 mm, which sets the gap between the two parallel PCBs. Outer shroud contacts protect the mating interface during alignment and handling, and the gold finish (2.00 µin) on the contacts keeps contact resistance low across repeated mating cycles.