The Hirose DF37C-40DP-0.4V(51) is a 40-position, 0.40 mm pitch header with outer shroud contacts, part of the DF37 series of board-to-board mezzanine connectors. It uses a 2-row configuration and is designed for surface-mount soldering, with a mated stacking height of 0.98 mm and a height above board of 0.75 mm. The gold-plated contacts with 2.00 µin (0.051 µm) thickness suit repeated mating cycles in signal-level applications. This connector is typically used in compact portable electronics, handheld devices, and other space-constrained assemblies where a low-profile, high-density board-to-board interconnect is required.
Key Specs for the Build
The 40 positions match a 40-circuit signal BOM line. The 0.75 mm height above board and 0.98 mm mated stack height define the z-axis clearance in the enclosure.
The 40-position DF37C-40DP-0.4V(51) sits alongside the 50-position DF37C-50DP-0.4V(51) in the same DF37 series. Both share the 0.40 mm pitch, 2-row layout, gold plating, and 0.75 mm height.
Mating Connector
The mated pair achieves a stacking height of 0.98 mm. Confirm the receptacle order code matches the 40-position, 0.40 mm pitch requirement.