DF37C-50DP-0.4V(51) — 50-Position, 0.40 mm Pitch Header for Tight Stacking
The Hirose DF37C-50DP-0.4V(51) is a 50-position, 2-row header from the DF37 series, designed for board-to-board mezzanine connections where vertical space is at a premium. The 0.016" (0.40mm) pitch packs 50 circuits into a compact footprint, and the 0.030" (0.75mm) height above board keeps the mated stack height at 0.98mm, suited for ultra-thin devices like smartphones, tablets, and wearable electronics where every tenth of a millimeter counts.
The 0.40 mm pitch is the tightest common class for FPC-style mezzanine connectors — routing a 50-position breakout under the header requires fine-line PCB traces (0.20 mm / 0.20 mm space is typical) and a via-in-pad or microvia strategy for the inner rows. The 0.75 mm height above board means the connector sits low enough to clear a 0.8 mm PCB stack, but the 0.98 mm mated stack height leaves only about 0.23 mm of clearance between the two boards — verify that no components on the underside of the top board protrude into that gap. The gold contact finish (2.00 µin) is standard for the DF37 series and provides corrosion resistance for the expected mating cycle life in portable electronics.
Position Count Options — 40, 50, or 60 Circuits
The DF37C series offers three position counts at the same 0.40 mm pitch, 0.75 mm height, and gold plating: 40 positions (DF37C-40DP-0.4V(51)), 50 positions (this part), and 60 positions (DF37C-60DP-0.4V(51)). If your BOM calls for 50 I/O lines, this is the match; the 40-position variant is for lower-density designs, and the 60-position variant adds 10 more lines at the same pitch. No other spec differs between them — same stack height, same contact finish, same active lifecycle status.