Board-Stacking Interconnect for Dense Mezzanine Designs
The Hirose DF37NC-50DS-0.4V(51) is a 50-position receptacle from the DF37 series, designed for board-to-board mezzanine stacking. The mated stack height is 0.98 mm, so the pair sits low in the z-axis, suited for thin-profile assemblies like handheld devices or camera modules.
The 0.40 mm pitch drives the PCB layout — each signal trace and via must fit within that narrow centerline, so the board design needs a fine-line capability.
