0.40mm Pitch Mezzanine Receptacle for Tight Board-Stacking
The HIROSE DF37NC(1.5)-50DS-0.4V(51) is a 50-position receptacle with center strip contacts in the DF37 series, designed for board-to-board mezzanine interconnects where the vertical gap is tight. The 0.016" (0.40mm) pitch packs 50 circuits into a compact dual-row footprint, and the mated stacking height of 1.5mm sets the z-height budget between parallel PCBs.
Position Count and the 40- vs 50-Position Choice
The 50-position DF37NC(1.5)-50DS-0.4V(51) sits at the high end of the DF37 receptacle range. Against the 40-position DF37NC(1.5)-40DS-0.4V(51), the extra 10 circuits add signal or power lines without changing the 0.40mm pitch or the 1.5mm stack height — the board footprint grows only in length, not in routing density.
SMT Termination and Board Layout
Surface-mount termination suits automated pick-and-place assembly. The 0.40mm pitch demands a controlled impedance layout and tight solder-paste stencil registration — the pad geometry on the PCB footprint must match the HIROSE recommended land pattern to avoid bridging.