The Hirose DF40C-30DP-0.4V(51) is a 30-position plug from the DF40 series, a board-to-board / FPC interconnect family built for tight z-height budgets. The outer shroud contacts shield the signal pins during mate and protect them from handling damage. Gold-plated contacts with 2.00µin thickness handle the insertion cycles a consumer device sees across assembly and field service.
Stack Height Flexibility
The mated stacking heights span 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, and 4mm — the same plug body mates with different receptacle heights to adjust the board-to-board gap. That range covers the thin end for a slim phone mid-frame up to a 4mm gap for a module stacked over a shield can. The 0.045" (1.14mm) height above board on this plug side keeps the overall stack low.
Solder Retention and Mounting
Surface mount with solder retention features — the connector has extra hold-down tabs that reflow to the board pads, anchoring the part against the shear force of cable strain or vibration during the device's life. The Tape & Reel packaging feeds into a standard pick-and-place line for high-volume assembly.
How the 30-Position Sits in the DF40C Line
The DF40C-30DP-0.4V(51) shares the same pitch, height, and gold plating as the 34-position DF40C-34DP-0.4V(51) and the 24-position DF40C-24DP-0.4V(51). The only difference that drives the BOM is the position count — 30 circuits vs 34 or 24. Pick the count that matches your signal bus width; the footprint and stack height are identical across the family.