Hirose DF40C-60DS-0.4V(51) — 60-Position, 0.40mm Pitch Mezzanine Receptacle
The Hirose DF40C-60DS-0.4V(51) is a 60-position receptacle from the DF40 series of board-to-board mezzanine connectors. The mated stacking height is 1.5mm, making it suited for ultra-low-profile parallel board stacking in compact electronics — think smartphones, tablets, or portable industrial modules where z-height is tight.
What the 0.40mm Pitch and 60 Positions Mean for Your Board Layout
At 0.40mm pitch, the footprint is dense — routing traces between pads requires a fine-line PCB capability and a controlled impedance stack if the signals are high-speed. The 60 positions fill a board edge length of about 12mm, which is efficient for a high-I/O mezzanine link. The 1.5mm stacking height means the two PCBs sit very close together; the connector body itself is only 0.057" (1.45mm) above the board, so the total gap between boards is just over a millimeter.
The contacts are gold-plated with a finish thickness of 2.00µin (0.051µm). That's a thin flash — adequate for signal-level currents and occasional mating cycles typical of internal board-to-board interconnects. It is not designed for repeated field reconnection or high-power duty.
The DF40C family offers the same 0.40mm pitch and 1.5mm stacking height in 50-position (DF40C-50DS-0.4V(51)) and 70-position (DF40C-70DS-0.4V(51)) variants. The choice is driven purely by the number of signals you need to route between boards — the footprint length scales linearly with position count, so swapping from 60 to 70 positions adds about 4mm to the board edge. There is also a DF40JC-60DS-0.4V(53) with the same 60 positions and pitch but a different body style; the JC suffix indicates a different locking mechanism or keying, so verify the mating header compatibility before switching.