Board-to-Board Mezzanine Receptacle, 30-Position, 0.40mm Pitch
The Hirose DF40HC(3.0)-30DS-0.4V(51) is a 30-position receptacle from the DF40 series, designed for board-to-board mezzanine stacking. It uses a 0.016" (0.40mm) pitch dual-row layout with center strip contacts, all gold-plated (2.00µin thickness) for signal integrity in compact assemblies. This is a surface-mount connector, typically used in portable electronics, camera modules, and other dense PCB stacks where z-height is tight.
Stacking Height and Mating Half
The connector is rated for a 3mm mated stacking height — the (3.0) suffix is the height code, not a tolerance. The mating header is the corresponding DF40 series pin header with the same (3.0) height code, such as the DF40C(3.0)-30DP-0.4V. The 0.40mm pitch and 2-row layout mean the board footprint is compact: each row of 15 contacts on 0.40mm centres, with a board-to-board gap of 3mm after mating. The 2.90mm height above board is the receptacle's own profile before mating.
The DF40HC(3.0)-30DS-0.4V(51) sits at 30 positions in a series that ranges from 10 to 80 positions at the same 0.40mm pitch. The 30-position variant is a common density — enough for a parallel data bus or a set of control lines in a compact mezzanine stack. For comparison, the DF40HC(3.0)-44DS-0.4V(51) carries 44 positions at the same 3mm stacking height and pitch, while the DF40HC(3.5)-30DS-0.4V(51) keeps 30 positions but increases the stacking height to 3.5mm. The choice between them is driven by the number of signals and the board-to-board gap budget.
Contact Plating and Signal Duty
Gold contacts with 2.00µin (0.051µm) thickness provide corrosion resistance for the mating cycle count in a mezzanine application.