Mezzanine Header for Tight Stack Heights
The Hirose DF40TC-20DP-0.4V(58) is a 20-position header from the DF40T series, designed for board-to-board mezzanine connections where vertical clearance is tight. The surface-mount package includes pick-and-place features and solder retention pads for automated assembly, and the gold-plated contacts (1.97µin thickness) suit signal-level interconnect duty in compact consumer, industrial, and telecom devices.
Mating and Assembly Notes
The header mates with the Hirose DF40C series receptacle (e.g., DF40C-20DS-0.4V(58)), forming a board-to-board stack height of 0.045" (1.14mm). The outer shroud contacts provide alignment during mating and reduce the risk of pin stubbing. No special tooling is required beyond standard SMT placement equipment; the pick-and-place feature and solder retention pads are integrated into the package.