0.40mm Pitch Mezzanine Header, 30 Circuits
The Hirose DF40TC-30DP-0.4V(58) is a 30-position header from the DF40T series, designed for board-to-board mezzanine stacking. The 0.045" (1.14mm) height above board sets the mated stack height — this is an ultra-low-profile interconnect for thin devices like smartphones, tablets, or compact camera modules where the z-axis budget is tight. The SMT termination with solder retention features keeps the part from shifting during reflow, and the pick-and-place vacuum pick area is built into the shroud profile for automated assembly lines.
30 Positions vs 20 and 40 — Same Footprint Class
The DF40TC-30DP-0.4V(58) sits between the 20-position DF40TC-20DP-0.4V(58) and the 40-position DF40TC-40DP-0.4V(58) in the same DF40T series. If your BOM calls for 30 signals, this is the exact position match; the 20-position version leaves 10 traces unrouted, and the 40-position version overhangs the footprint. No pitch or height change to re-layout for.
No discontinuation notice or last-time-buy window has been issued.