The Hirose DF9-13S-1V(32) is a 13-position receptacle with outer shroud contacts, part of the DF9 series of board-to-board mezzanine connectors. It sits on a 1.00 mm pitch in a dual-row layout, with a height above board of 3.30 mm and a mated stacking height of 4.3 mm — the z-height budget you design around when pairing it with the matching DF9-13P-1V(32) header.
The 3.30 mm standoff above the board gives clearance for passives under the connector body; the 4.3 mm mated stack height is the total z-height from the bottom of the mating header's solder tails to the top of this receptacle's shroud. That dimension is fixed by the design of the DF9 series — no height-adjustment option exists, so your board-to-board spacing is locked at 4.3 mm once you commit to this pair.
13 Positions vs the 15- and 19-Position Siblings
The DF9-13S-1V(32) shares the same 1.00 mm pitch, 3.30 mm height, tin contact finish, and SMT mounting as the DF9-15S-1V(32) and DF9-19S-1V(32). The only difference is position count: 13 circuits against 15 on the DF9-15S-1V(32) and 19 on the DF9-19S-1V(32). The footprint length scales with position count — a 13-position board layout will not accept a 15-position receptacle without a new PCB. Match the BOM circuit count exactly; there is no drop-in upgrade path across these three.
This receptacle mates with the DF9-13P-1V(32) header, which carries center strip contacts on the same 1.00 mm pitch and 3.30 mm height. Both parts are SMT-terminated — no through-hole, no press-fit. The header's center strip contacts engage the receptacle's outer shroud contacts in a dual-beam interface.
The part is ROHS3 compliant. No official second-source cross-reference exists; the DF9 series is Hirose-proprietary in pitch and stacking height.