Board-to-Board Stacking Receptacle, 1.00 mm Pitch
The Hirose DF9-15S-1V(32) is a 15-position receptacle from the DF9 series, designed for parallel board stacking. It uses a 0.039" (1.00mm) pitch dual-row layout and surface-mount termination, making it a compact interconnect for mezzanine-style assemblies where board-to-board spacing is fixed at a 4.3 mm mated stack height.
Position Count and Stack Height
At 15 positions, this receptacle sits between the 13-position DF9-13S-1V(32) and the 19-position DF9-19S-1V(32) in the same DF9 series — all sharing the same 0.039" (1.00mm) pitch, 3.30 mm height above board, and 4.3 mm mated stack height. The position choice is a straight circuit-count match to the BOM; the footprint and board spacing are identical across the three variants.
For higher reconnect duty, the gold-plated sibling DF9-15S-1V(69) carries 8.00 µin (0.203 µm) gold over the same base structure, which would be the pick for field-service or frequent board swaps.