Board-to-Board Mezzanine Header, 25 Positions
The Hirose DF9-25P-1V(32) is a 25-position, 2-row header with center strip contacts, part of the DF9 series of board-to-board mezzanine connectors. The 0.039" (1.00 mm) pitch keeps the board footprint tight for dense PCB layouts, while the 4.3 mm mated stack height sets a fixed z-height budget between parallel boards.
The 25 positions of the DF9-25P-1V(32) sit between the 21-position DF9-21P-1V(32) and the 31-position DF9-31P-1V(32) in the same DF9 series, all sharing the same 0.039" (1.00 mm) pitch, 4.3 mm stack height, and tin contact finish.
Mating Half and Footprint Fit
This header mates with the DF9-25S-1V(32) receptacle, which also uses a 0.039" (1.00 mm) pitch, 2 rows, and the same 4.3 mm stack height. The board guide on both halves aligns the pair during assembly, and the solder retention feature on the header keeps it planted through wave or reflow. Confirm the receptacle part number against your BOM before committing.