Board-to-Board Stacking Receptacle for 1.00 mm Pitch Mezzanine Designs
The Hirose DF9-25S-1V(32) is a 25-position, dual-row receptacle from the DF9 series, designed for parallel board stacking with a fixed mated stack height of 4.3 mm.
Mating Half and Stack Height — What Fits
The mating header for this receptacle is the DF9-25P-1V(32), a 25-position, dual-row header with center strip contacts at the same 1.00 mm pitch. When mated, the pair achieves a board-to-board stack height of 4.3 mm — that is the dimension from the bottom of the top PCB to the top of the bottom PCB. If your enclosure or mezzanine spacing calls for a different z-height, the DF9 series offers other stack height options; for this specific order code, the 4.3 mm height is fixed and non-negotiable.
Tin is a low-cost contact finish that works well for connections that are mated infrequently — think internal board stacks that stay assembled through the product life. It is not suited for applications requiring frequent mating cycles or field-service reconnection, where gold plating would be the better choice. For a mezzanine board-to-board interconnect that is mated once during final assembly and never touched again, the tin finish is appropriate and cost-effective.
The DF9 series includes receptacles at 19, 25, and 31 positions, all sharing the same 1.00 mm pitch, 4.3 mm stack height, and tin-plated contacts. The 25-position DF9-25S-1V(32) sits between the 19-position DF9-19S-1V(32) and the 31-position DF9-31S-1V(32). The footprint, routing pitch, and mating header style are identical across all three, so swapping between them is a straight position-count change with no board layout rework.
No official second-source cross-reference exists on record; the DF9-31S-1V(32) is a higher-position sibling but not a functional substitute for a 25-circuit BOM line.