1.00 mm Pitch Dual-Row Header for Board-to-Board Stacking
The Hirose DF9-41P-1V(32) is a 41-position header from the DF9 series, designed for parallel board-to-board stacking with a 4.3 mm mated stack height. The header uses center strip contacts with a tin finish — a cost-effective choice for designs where the mating cycle count stays moderate. Board guide features on the housing align the header during pick-and-place, and the solder retention pads keep it seated through reflow.
Tin vs Gold Contact Finish — What Drives the Choice
Tin works well for low-cycle applications — think a single mate during final assembly or occasional field service — where the contact wipes through the oxide layer on first mate. For designs needing repeated mating cycles or operating in corrosive environments, the sibling DF9-41P-1V(69) uses gold contacts at 8.00 µin (0.203 µm). Gold resists oxidation and maintains stable contact resistance across hundreds of cycles, but adds cost. If your BOM calls for the gold variant, the 41-position count and 1.00 mm pitch footprint are identical, so the board layout stays the same.
The 0.039" (1.00 mm) pitch leaves about 0.5 mm between adjacent pads — enough for a single trace between them on a standard PCB, but tight for differential pairs or wider traces.