Hirose DF9 series header, center strip contacts, 41 positions, dual row, 0.039" (1.00mm) pitch, surface mount, gold contact finish, 4.3mm mated stacking height.
| Parameter | Value |
|---|---|
| Series | DF9 |
| Mounting | Surface Mount |
| Connector type | Header, Center Strip Contacts |
| Height above board | 0.130\" (3.30mm) |
| Mated stacking heights | 4.3mm |
| Pitch | 0.039\" (1.00mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Board Guide, Solder Retention |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 41 |
| Contact finish thickness | 8.00µin (0.203µm) |
The 0.039" (1.00mm) pitch packs 41 circuits into a compact footprint — the 4.3mm mated stacking height sets the gap between PCBs, so the board stack-up needs to match that dimension exactly.
RoHS compliant per the listing. No official direct cross-reference or second-source is recorded; the tin-finish DF9-41P-1V(32) is a functional alternative if the application can tolerate fewer mating cycles.
The mated stacking height is 4.3mm — the gap between the two parallel PCBs when the header mates with the corresponding receptacle.
Yes, the DF9-41P-1V(69) is RoHS Compliant.
The tin-finish variant DF9-41P-1V(32) shares the same 41 positions, 1.00mm pitch, and 4.3mm stacking height, but uses 39.4µin tin contacts instead of 8.00µin gold — suited for lower mating-cycle applications.