The Hirose DF9-9P-1V(32) is a 9-position, 2-row header with center strip contacts, designed for surface-mount board-to-board stacking. The 0.039" (1.00mm) pitch keeps the footprint compact, while the 4.3mm mated stacking height sets the board-to-board clearance — a fixed dimension that drives enclosure z-height and component keep-out zones on both boards. The header includes a board guide to simplify alignment during assembly and solder retention features that hold the part in place through reflow.
For higher reconnect duty, the gold-plated sibling DF9-9P-1V(61) is the same 9-position, 1.00mm pitch header with gold contacts, a better fit for field-service or frequent board swaps.