Board-to-Board Stacking Header for 1.00 mm Pitch Mezzanine Designs
The DF9A-31P-1V(69): It is designed for surface-mount board-to-board stacking applications where the mated stack height is 4.3 mm — a common gap for parallel PCB assemblies in compact consumer electronics, handheld devices, and internal module interconnects. The gold-plated contacts on both rows provide reliable signal connections across repeated mating cycles, and the integrated board guide aids alignment during reflow assembly.
With 31 positions across two rows, one row carries 16 contacts and the other 15; the footprint must account for this asymmetry when laying out the land pattern. The 0.130" (3.30mm) height above board sets the component clearance on the header side, while the 4.3 mm mated stack height determines the total z-axis envelope between the two PCBs.