DF9A-31S-1V(22) — 31-Position Board-to-Board Receptacle
It uses a 0.039" (1.00mm) pitch in a dual-row layout, with a mated stack height of 4.3mm and a height above board of 0.130" (3.30mm). The tin-plated contacts and surface-mount termination suit it for internal signal interconnects in compact electronic assemblies where the board spacing is tight. The 1.00mm pitch keeps the footprint compact — expect a 31-position dual-row layout to occupy roughly 16mm along the board edge, which matters for routing density in multi-connector designs.
Position Count vs. Siblings
The DF9 series offers the same 0.039" (1.00mm) pitch and 0.130" (3.30mm) height across position counts. The 31-position DF9A-31S-1V(22) sits between the 11-position DF9A-11S-1V(22) and the 41-position DF9A-41S-1V(22).