Hirose DF9 series receptacle, outer shroud contacts, DF9B-11S-1V(32), 11 positions, 2 rows, 0.039" (1.00mm) pitch, surface mount, tin contact finish, 39.4µin (1.00µm) thickness, solder retention, 0.130" (3.30mm) height above board, 4.3mm mated stacking height, Tape & Reel.
| Parameter | Value |
|---|---|
| Series | DF9 |
| Mounting | Surface Mount |
| Connector type | Receptacle, Outer Shroud Contacts |
| Height above board | 0.130\" (3.30mm) |
| Mated stacking heights | 4.3mm |
| Pitch | 0.039\" (1.00mm) |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Solder Retention |
| Contact finish | Tin |
| Rows | 2 |
| Positions | 11 |
| Contact finish thickness | 39.4µin (1.00µm) |
The Hirose DF9B-11S-1V(32) is an 11-position receptacle from the DF9 series, designed for parallel board-to-board stacking. The 0.039" (1.00mm) pitch keeps the footprint compact — tight enough for dense layouts but still hand-solderable under a scope. At 3.30 mm above the board, the receptacle sits low enough for slim enclosures.
Active lifecycle, RoHS compliant.
Price comparison is critical for BOM cost management and selecting the best distributor.
Immediate availability is essential for avoiding production delays and ensuring supply continuity.
Datasheet provides detailed specifications needed for design validation and fit assessment.
Compatibility ensures the part can substitute without redesign, saving time and cost.
Lifecycle status determines long-term availability for product support and obsolescence planning.
Mating height is necessary for mechanical integration and board stacking design.