1.00 mm pitch mezzanine header, 25 positions, 3.30 mm stack height
The Hirose DF9B-25P-1V(32) is a 25-position, 2-row header from the DF9 series, designed for parallel board-to-board stacking. The 0.039" (1.00 mm) pitch keeps the board footprint compact while allowing enough routing channels between pads for a 2-layer PCB. With a height above board of 0.130" (3.30 mm) and a mated stack height of 4.3 mm when paired with the matching DF9B-25S-1V(32) receptacle, this connector suits low-profile mezzanine applications where the z-axis clearance is tight — think telecom line cards, instrumentation, or portable device main boards. The center strip contact arrangement — header with contacts on both sides of a central insulator — provides a balanced mating interface that reduces the risk of skew during engagement.