0.039" Pitch, 31-Position SMT Receptacle for Board-to-Board Stacking
It uses a 0.039" (1.00mm) pitch across two rows, with a mated stack height of 4.3mm and a height above board of 0.130" (3.30mm). The surface-mount termination and solder retention features suit it for automated assembly in compact consumer electronics, handheld devices, and internal board interconnects where Z-height is tight.
With 31 positions, this receptacle matches BOM lines requiring a 31-circuit board-to-board interconnect. It mates with the DF9B-31P-1V(69) header, which shares the same 0.039" (1.00mm) pitch, 0.130" (3.30mm) height above board, and gold contact finish. The header uses center strip contacts, while this receptacle uses outer shroud contacts — the shroud provides alignment and mechanical protection during mating.