51-Position Board-to-Board Receptacle for Tight Stacking
The Hirose DF9B-51P-1V(69) is a 51-position receptacle with outer shroud contacts from the DF9 series, designed for parallel board-to-board stacking at a 4.3mm mated height. The 0.039" (1.00mm) pitch and dual-row layout pack 51 signal paths into a compact footprint, making it a fit for dense mezzanine interconnects in portable electronics, industrial controls, and telecom line cards. Gold plating on the contacts (8.00µin thickness) suits moderate-cycle-count applications where corrosion resistance matters.
Position Count and Stack Height Drive the Fit
At 51 positions, this is the highest-circuit-count member among the DF9B-1V(69) receptacles — compare to the 41-position DF9B-41S-1V(69) or the 21-position DF9B-21S-1V(69), all sharing the same 1.00mm pitch, 4.3mm stack height, and gold plating.
Surface-Mount Assembly with Solder Retention
Tape & Reel packaging means it feeds into a pick-and-place line without a tray change — the reel format is standard for high-volume SMT assembly.